Product
| Layers: | 1st floor |
| Copper foil thickness: | 35UM |
| Finished product thickness: | 0.11±0.03MM |
| Thickness of immersion gold: | 2 miles |
| Surface treatment: | Sinking gold |
| Product Introduction: Processing using single-sided non adhesive rolled copper raw materialsUsing high-quality covering film, it has outstanding dielectric properties, mechanical properties, and radiation resistance at high temperatures. A black electromagnetic shielding film is attached to the covering film to shield various signal interferences. This type of product is used for connecting industrial motherboards. | |
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