With the continuous development of electronic technology and the increasing popularity of SMT technology, the volume of microcontroller chips is becoming smaller and the number of pin positions is gradually increasing, especially for BGA microcontroller chips. Due to the fact that BGA microcontroller chips are not distributed according to traditional design, but rather at the bottom of the chip, it is undoubtedly impossible to judge the quality of solder joints based on traditional manual visual inspection. Therefore, testing must be conducted based on ICT and even functionality. Therefore, the application of X-ray detection technology in post reflow inspection of SMT is becoming increasingly widespread. It can not only qualitatively analyze solder joints, but also timely detect and correct faults.

Every industry has some effective auxiliary tools. In the electronics industry, X-RAY testing equipment is one of them.

                                                                    The working principle of X-ray detection equipment.

Firstly, X-RAY devices mainly utilize the penetrating power of X-rays. X-rays have short wavelengths and high energy. When a substance shines on an object, it only absorbs a small portion of X-rays, while the energy of most X-rays passes through the gaps between the atoms of the substance, exhibiting strong penetrating power.

2. The X-ray device can detect the relationship between X-ray penetration and material density, and distinguish substances of different densities through differential absorption. In this way, if the detected object has different thicknesses, shape changes, X-ray absorptions, and images, different black and white images will be produced.

3. It can be used for IGBT semiconductor testing, BGA chip testing, LED light strip testing, PCB bare board testing, lithium battery testing, and non-destructive testing of aluminum castings.

Simply put, use an interference free microfocus X-ray device to output high-quality fluoroscopy images, which are then converted into signals received by a flat panel detector. All functions of the operating software can be completed using only the mouse, making it easy to use. Standard high-performance X-ray tubes can detect defects below 5 microns, some X-ray equipment can detect defects below 2.5 microns, the system can magnify up to 1000 times, and objects can tilt. X-ray equipment can be manually or automatically detected, and detection data can be generated automatically.

X-ray technology has evolved from 2D detection stations to current 3D detection methods. The former is the projection X-ray inspection method, which can produce clear visual images of solder joints on a single board. However, the commonly used double-sided reflow soldering board has poor performance, resulting in overlapping visual images of two solder joints, making it difficult to distinguish. The latter's 3D detection method uses layered technology, which concentrates the beam on any layer and projects the corresponding image onto a high-speed rotating receiving surface. Due to the rotation of the receiving surface, the image at the intersection point is very clear, and the images of other layers are removed. 3D detection can independently image the solder joints on both sides of the board.

3DX-ray technology can not only detect double-sided solder plates, but also comprehensively detect multi-layer image slices of invisible solder joints such as BGA, namely the upper, middle, and lower image slices of BGA solder ball joints. In addition, this method can also detect the through-hole of PTH solder joints and check whether the through-hole solder is sufficient, greatly improving the connection quality of solder joints.

Replace ICT with X-rays.

With the increase of layout density and the decreasing size of equipment, the point space for ICT testing is becoming smaller and smaller when designing layouts. Moreover, for complex layouts, if they are directly sent from the SMT production line to the functional testing position, it will not only reduce the product qualification rate, but also increase the cost of fault diagnosis and maintenance of the circuit board. Even if delivery is delayed, in today's fiercely competitive market, using X-ray inspection instead of ICT inspection can ensure the production trajectory of functional testing. In addition, using X-rays for batch inspection in SMT production can reduce or even eliminate batch errors.

The scope of use of X-RAY detection device.

Industrial X-RAY testing equipment is widely used in industries such as lithium battery testing, semiconductor packaging, automotive, and circuit board assembly (PCBA). Measure the position and shape of internal objects after packaging, identify problems, confirm product qualification, and observe internal conditions.

2. Specific application scope: mainly used for SMT LED.BGA.CSP flip chip inspection, semiconductor, packaging components, lithium battery industry, electronic components, automotive parts, photovoltaic industry, aluminum die-casting casting, molded plastics, ceramic products and other special industries.