At present, the production process of FPC circuit boards mainly includes cutting, drilling, VCP, copper plating, dry film pasting, exposure, development, etching, dry film removal, cleaning, protective film pasting, lamination, pure tin plating, gold plating, screen printing, punching, electrical testing, reinforcement film bonding, functional testing and other processes. The specific process flow is shown in the figure: 
                                           

The control of FPC circuit board clean production process is a traditional practice in the electroplating industry, which wastes water resources and greatly increases the load of sewage treatment. The following improvement measures can be taken: (1) Automatic assembly line operation: The circuit board is fed into various sealed electroplating tanks by the unwinding machine, which reduces water consumption and wastewater generation to a certain extent. (2) Using deionized water to prepare electroplating solution reduces impurities entering the electroplating tank, prolongs the service life of the plating solution, and reduces the amount of waste liquid. (3) The plating solution (concentrated wastewater) carried out by the plated parts enters the recycling tank and is cleaned with deionized water to reduce the evaporation of the solution, prevent the phenomenon of running, emitting, dripping, and leaking caused by manual operation, reduce pollution, and minimize the loss of plating solution, ensuring smooth production. (4) The use of deionized water for solution preparation and cleaning avoids impurity contamination in the solution, prolongs the service life of the plating solution, and ensures product quality while reducing wastewater treatment costs. (5) The timely recycling and utilization of intermediate products and solvents in the production process greatly reduces the generation and emission of pollutants.