1Sinking copper 

IICopper deposition, also known as chemical copper deposition, is mainly based on the displacement reaction in chemistry to deposit a layer of copper on the hole wall as a conductive lead for subsequent copper electroplating. If it is a conventional thin copper, its thickness is generally0.5μmabout. As the most traditional pre electroplating copper preparation process, it has the following advantages and disadvantages:

IIIadvantage:

（1）Copper metal has excellent conductivity (copper wire is commonly used as the conductor in wires);

（2）The thickness can be adjusted within a wide range and has a wide adaptability (currently the lowest in the industry)0.3μmLeft and right, up to the highest30μm, directly replacing the subsequent electroplating copper process);

（3）Mature and stable technology, suitable for all types of circuit board products（PCB/FPC/RFPCB/Carrier board/Metal substrate/Ceramic substrates, etc.).

Disadvantages:

（1）Containing formaldehyde, which is harmful to the health of operators;

（2）Large equipment investment, high production costs, and significant environmental pollution;

（3）Short time management, generally effective for3~6Hour.

 

 2、 Black hole

 

Black hole is a type of direct electroplating technology, which mainly uses physical principles to adsorb carbon powder on the surface of the hole wall, forming a conductive layer as a conductive lead for subsequent copper electroplating. Normally, its thickness is0.5~1μmAs one of the mainstream pre electroplating copper preparation processes, it has the following advantages and disadvantages:

 

advantage:

（1）Free of formaldehyde, with minimal impact on the health of workers and minimal pollution to the environment;

（2）The equipment investment is not large, the waste treatment is simpler, and the process cost is lower than that of copper deposition;

（3）The medication and process are relatively reduced, and the timeliness can be achieved48HMore convenient for maintenance and management.

Disadvantages:（1）In terms of conductivity, conductive carbon powder is weaker than deposited copper layers;

（2）Its applicability is not as wide as that of copper deposition. Therefore, although it has been widely used, it is currently mainly used in the industry for double-sided panels, such as high-end onesHDIWaiting for products, almost not using

 

 3、 Black Shadow

 

Black shadow, strictly speaking, is a further development of black hole technology, with similar principles, advantages and disadvantages, and superior to black hole technology. The main difference is that the conductive layer of the black hole is carbon powder, while the conductive layer of the black shadow is graphite.

 

In addition, black holes are generally not used for high-end products or with complex processes, but black shadow can be used. Black shadow technology has partially replaced copper deposition and is widely used in high-end circuit boards, such asHDIBoardICSometimes, the black shadow process is superior to the copper deposition process, such as selective pattern electroplating, for carrier boards and other applications.