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Circuit board stacking

Since Hanson, a German, put forward the concept of "printed circuit" at the beginning of the 20th century (1903), the development of printed circuit has a history of more than 110 years. Although Hanson did not manufacture "printed circuit" in the true sense at that time, he did make conductor arrays arranged in a certain geometric shape on insulating substrates, which met the needs of telephone exchanges. Afterwards, there were Edison, Berry, and Mx Schoop Charles Ducas and others have invented various methods for processing printed circuits and proposed the basic concept of circuit pattern transfer. Before World War II, there was a breakthrough in printed circuit technology. Austrian Paul Eisler used etching to manufacture printed circuits and successfully applied them to the Allies' highly reliable weapon near explosive fuses. After World War II, printed circuit technology developed rapidly. In 1947, the American Aviation Board and the National Bureau of Standards initiated a seminar on printed circuits, categorizing previous methods of circuit manufacturing into six types: metal paste coating, spray coating, vacuum deposition, chemical deposition, compression molding, and powder coating. However, none of these methods were able to achieve large-scale industrial production.

Until the early 1960s, due to the solution of the bonding strength and welding resistance issues between the copper box and laminated board covered with rigid laminates, the performance was stable and reliable, and industrial production was achieved. Copper box etching became the mainstream of printed board manufacturing technology. Starting with single-sided printed boards: In the 1960s, double-sided printed boards with plated holes were also mass-produced. In the 1970s, multi-layer printed boards developed rapidly and continued to move towards high precision, high density, thin wires, small apertures, high reliability, low cost, automation, and continuous production. In the 1980s, surface mount printed boards (SMB) gradually replaced plug-in (TtHr) printed boards and became the mainstream of production. Since the 1990s, surface mount technology has further developed from quad flat packaging (QFP) to ball array packaging (BGA), and high-density BGA printed boards have been rapidly developed. At the same time, chip level packaging (CSP) printed boards and... The printed circuit board for multi chip module packaging technology (MCM-L) using organic laminated board materials as substrates has also rapidly developed.

Represented by the Surface Laminar Circuit (SLC) technology developed by IBM in Japan in 1999, the new generation of printed circuit boards is high-density stacked thin multilayer boards with buried holes, official holes, hole diameters below 0.15mm, and wire widths and spacings below 0.1mm, known as high-density interconnect (HDI) boards In Japan, HDI boards are referred to as stacked multilayer (BUM) boards, and one to twenty different manufacturing methods have been developed. Among them, the more famous ones include Panasonic's ALIVH method, Toshiba's B'it method, CMK's CLLAVIS method, in addition to the SLC method.

The United States established the Internet Technology Research Institute (HTRI) in 1994, which published an evaluation report in 1997 and officially proposed the new concept of HDI High Density Interconnection. The characteristic of HDI printed boards is that they have micro conductive holes with a diameter of less than or equal to 0.15mm, and most of them are blind holes and buried holes: the ring width of the holes is less than or equal to 0.25mm; The line width and spacing are less than or equal to 0.075mm; The contact density is 130 points/in2: the wiring density is greater than or equal to 117 lines/in.

At the beginning, printed circuit boards were etched onto rigid substrates. As electronic products became thinner and lighter, more and more of themflexible printed circuitIt has been generated, and Xiaobo will continue to explain it to everyone in the futureFlexible circuit boardRelated knowledge.

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