The difference between copper substrate and aluminum substrate

Aluminum substrate is a metal based copper-clad laminate with good heat dissipation function. Generally, a single panel is composed of three layers: circuit layer (copper foil), insulation layer, and metal substrate. Commonly seen in LED lighting products. There are two sides, the white side is for soldering LED pins, and the other side presents the natural color of aluminum, usually coated with thermal conductive paste and in contact with the thermal conductive part. There are also ceramic substrates and so on.


Copper substrate is a type of copper-clad metal copper substrate, which has a very similar overall structure to aluminum substrate. It has good thermal conductivity, electrical insulation performance, and mechanical processing performance, including metal layer, bonding layer (insulation layer), and conductive wiring layer, all of which are indispensable. The metal layer (block) mainly serves the functions of heat dissipation, shielding, cladding, or grounding. Due to the differences in performance and corresponding PCB processing technology between copper and aluminum, copper substrates have more performance advantages than aluminum substrates.


Application of Copper Based Circuit Board


The copper substrate circuit layer requires a high current carrying capacity, so thicker copper foil should be used, with a thickness generally ranging from 35 μ m to 280 μ m; The thermal insulation layer is the core technology of copper substrates. The central thermal conductive component is composed of alumina and silicon powder, as well as a polymer filled with epoxy resin. It has a low thermal resistance (0.15), excellent viscoelastic properties, and the ability to resist thermal aging, and can withstand mechanical and thermal stress. The copper substrate metal base is the supporting component of the copper substrate, which requires high thermal conductivity. Generally, copper plates can also be used (among which copper plates can provide better thermal conductivity), suitable for conventional mechanical processing such as drilling, punching and cutting.

Advantages of Copper Based Circuit Boards

The copper substrate circuit layer has a high load-bearing capacity, thus utilizing copper foil thicknesses ranging from 35 μ m to 280 μ m; The insulation layer is the copper substrate of the central technology, and the central component is composed of two epoxy resin compositions filled with alumina and silica and a polymer with a triple thermal conductivity and low thermal resistance (0.15). Has viscoelasticity, heat aging resistance, and can withstand mechanical and thermal stress. Copper based metal layer is a copper based support component with high thermal conductivity, usually copper, which can also be used (copper provides better thermal conductivity), suitable for conventional mechanical processing such as drilling, punching, and cutting.

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