Fan shaped soft hard integrated circuit board

Fan shaped soft hard integrated circuit board

Layers: 4-layer soft hard bonding board
Copper foil thickness: 35UM
Finished product thickness: 1.6±0.16MM
Thickness of immersion gold: 2 miles
Surface treatment: Sinking gold
Product introduction: Adopting single-sided FR4 double-sided adhesive free rolled copper single-sided FR4 structure compression. The flexible layer solder mask uses high-quality covering film, which has outstanding dielectric properties, mechanical properties, and radiation resistance at high temperatures. The hard layer solder mask uses green oil, and this type of product is widely used in communication, industrial control, medical and other fields.


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