News
Time:2022-10-13
======Training Materials for the Design Department of Shiboteng=======DuPont Pyralux ® Series substrate
| Application fields of various materials for soft boards | |||||
| DuPont Pyralux ® Soft board material | |||||
| FR series has halogen adhesive sheets (referred to as pure adhesive) | |||||
| Product model | Glue thickness mil (um) | Product code | Glue thickness mil (um) | Packaging specifications | application area |
| FR0100 | 1（25） | FR0400 | 4(102) | 24in(W)*250ft | FPC multi-layer board, hard board, and soft hard bonding board interlayer composite |
| FR0200 | 1（51） | FR1500 | 1/2(13) | 250mm*100m | |
| FR0300 | 1（76） | FR1501 | 0.7（18） | ||
| LF series halogen-free adhesive sheet (referred to as pure adhesive) | |||||
| Product model | Glue thickness mil (um) | Product code | Glue thickness mil (um) | Packaging specifications | application area |
| LF0100 | 1（25） | LF0400 | 4(102) | 24in(W)*250ft | FPC multi-layer board, hard board, and soft hard bonding board interlayer composite |
| LF0200 | 1（51） | LF1500 | 1/2(13) | 250mm*100m | |
| LF0300 | 1（76） | LF1501 | 0.7（18） | ||
| HXC series black cover film Coverlay | |||||
| Product model | ADH thickness mil (um) | PI thickness (um) | Packaging specifications | application area | |
| HXC1215 | 0.6(15) | 12 | 249mm*200m | The black epoxy coating specified for the Apple project has a shelf life of 4 months | |
| HXC1220 | 0.8(20) | 12 | 500mm*200m | ||
| HXC1225 | 1(25) | 12 | |||
| HXC2525 | 1(25) | 25 | |||
| FR series yellow cover film Coverlay (including halogen) | |||||
| Product model | ADH thickness mil (um) | PI thickness (um) | Packaging specifications | application area | |
| FR0110 | 1(25) | 25 | 24in(610mm)* | The industrial universal yellow covering film has a higher flame retardant rating than the halogen-free LF series. | |
| FR0120 | 1(25) | 51 | 250ft(76m) | ||
| FR7001 | 1/2(13) | 13 | |||
| FR7013 | 1(25) | 13 | |||
| LF series yellow cover film Coverlay (halogen-free) | |||||
| Product model | ADH thickness mil (um) | PI thickness (um) | Packaging specifications | application area | |
| LF0110 | 1(25) | 25 | 24in(610mm)* | Optoelectronic and industrial halogen-free yellow coating film, with a normal operating temperature of up to 140 ° C | |
| LF0120 | 1(25) | 51 | 250ft(76m) | ||
| LF7001 | 1/2(13) | 13 | 250mm*100m | ||
| LF7013 | 1(25) | 13 | |||
| FR series Bondply (referred to as double-sided adhesive PI, containing halogens) | |||||
| Product model | ADH adhesive thickness mil (um) on both sides | PI thickness (um) | Packaging specifications | application area | |
| FR0111 | 1(25) | 25 | 24in(610mm)* | Double sided adhesive PI, acrylic adhesive system, sealed and stored at room temperature, suitable for multi-layer board inner layer and soft hard bonding board inner layer, especially for inner layer 2 2 structure, double-sided etched circuit laminated structure, good filling performance, optimized structure, and reduced pressing times | |
| FR0121 | 1(25) | 51 | 250ft(76m) | ||
| FR0131 | 1(25) | 76 | |||
| FR0212 | 2（51） | 25 | |||
| FR7021 | 1/2（13） | 1/2（13） | |||
| FR7016 | 1(25) | 1/2（13） | |||
| FR7081 | 2（51） | 1/2（13） | |||
| FR1515 | 1/2（13） | 25 | |||
| LF series Bondply (referred to as double-sided adhesive PI, halogen-free) | |||||
| Product model | ADH thickness mil (um) | PI thickness (um) | Packaging specifications | application area | |
| LF0111 | 1(25) | 25 | 24in(610mm)* | Double sided adhesive PI, acrylic adhesive system, sealed and stored at room temperature, suitable for multi-layer board inner layer and soft hard bonding board inner layer, especially for inner layer 2 2 structure, double-sided etched circuit laminated structure, good filling performance, optimized structure, and reduced pressing times | |
| LF0121 | 1(25) | 51 | 250ft(76m) | ||
| LF0131 | 1(25) | 76 | |||
| LF0212 | 2（51） | 25 | |||
| LF7021 | 1/2（13） | 1/2（13） | |||
| LF7016 | 1(25) | 1/2（13） | |||
| LF7081 | 2（51） | 1/2（13） | |||
| LF1515 | 1/2（13） | 25 | |||
| HXN series ultra-thin yellow cover film Coverlay (epoxy type) | |||||
| Product model | ADH thickness mil (um) | PI thickness (um) | Packaging specifications | application area | |
| HXN0510 | 0.4（10） | 5 | 250mm*200m | Epoxy ultra-thin cover film, specifically designed for LCM modules, with excellent flexibility performance | |
| HXN0515 | 0.6(15) | 5 | 500mm*200m | ||
| HXN0810 | 0.4（10） | 8 | |||
| HXN0815 | 0.6(15) | 8 | |||
| Adhesive substrate FR (halogen containing) \ LF (halogen-free) | |||||
| FR series single-sided adhesive substrate (including halogen) | |||||
| Product model | Cu OZ/ft2(um) | Glue thickness (um) | PI thickness (um) | Packaging specifications | application area |
| FR9110R | 1(35) | 25 | 25 | 24in(610 mm)* | Industrial single-sided adhesive substrate, with a normal working temperature of up to 140 ° C, mainly used in industrial, optoelectronic, automotive, and medical applications |
| FR9120R | 1(35) | 25 | 51 | 36in(914 mm) | |
| FR9130R | 1(35) | 25 | 76 | A box of 25 sheets | |
| FR9150R | 1(35) | 25 | 127 | ||
| FR series double-sided adhesive substrate (including halogen) | |||||
| Product model | Cu OZ/ft2(um) | Glue thickness (um) | PI thickness (um) | Packaging specifications | application area |
| FR9111R | 1(35) | 25 | 25 | 24in(610 mm)* | Double sided adhesive substrate, with a working temperature of up to 140 ° C, mainly used in industrial, optoelectronic, automotive, medical, and aerospace industries |
| FR9121R | 1(35) | 25 | 52 | 36in(914 mm) | |
| FR9131R | 1(35) | 25 | 76 | A box of 25 sheets | |
| FR9222R | 2(70) | 25 | 127 | ||
| LF series single-sided adhesive substrate (halogen-free) | |||||
| Product model | Cu OZ/ft2(um) | Glue thickness (um) | PI thickness (um) | Packaging specifications | application area |
| LF9110R | 1(35) | 25 | 25 | 24in(610 mm)* | Industrial single-sided adhesive substrate, with a normal working temperature of up to 140 ° C, mainly used in industrial, optoelectronic, automotive, and medical applications |
| LF9120R | 1(35) | 25 | 51 | 36in(914 mm) | |
| LF9130R | 1(35) | 25 | 76 | A box of 25 sheets | |
| LF9150R | 1(35) | 25 | 51 | ||
| LF series double-sided adhesive substrate (halogen-free) | |||||
| Product model | Cu OZ/ft2(um) | Glue thickness (um) | PI thickness (um) | Packaging specifications | application area |
| LF9111R | 1(35) | 25 | 25 | 24in(610 mm)* | Industrial single-sided adhesive substrate, with a normal working temperature of up to 140 ° C, mainly used in industrial, optoelectronic, automotive, and medical applications |
| LF9121R | 1(35) | 25 | 51 | 36in(914 mm) | |
| LF9131R | 1(35) | 25 | 76 | A box of 25 sheets | |
| LF9222R | 2(70) | 25 | 51 | ||
| Adhesiveless FCCL | |||||
| AC series single-sided adhesive free substrate | Cu um(OZ/ft2) | PI thickness (um) | Cu um(OZ/ft2) | Packaging specifications | application area |
| AC121200EM/R | 12(1/3) | 12 | 12(1/3) | 250mm*100m | Consumer electronics single-sided adhesive free substrate, applied to ordinary single panel and multi-layer soft board |
| AC122000EM/R | 12(1/3) | 20 | 12(1/3) | 500mm*100m | |
| AC182000EM/R | 18(1/2) | 20 | 18(1/2) | ||
| AC182500EM/R | 18(1/2) | 25 | 18(1/2) | ||
| AC181200EM/R | 18(1/2) | 12 | 18(1/2) | ||
| AC352500EY/R | 35(1.0) | 25 | 35(1.0) | ||
| AC354500EY/R | 35(1.0) | 45 | 35(1.0) | ||
| AK series double-sided adhesive free substrate (HTE copper) | Cu um(OZ/ft2) | PI thickness (um) | Cu um(OZ/ft2) | Packaging specifications | application area |
| AK121212EM | 12(1/3) | 12 | 12(1/3) | 250mm*100m | Consumer electronics double-sided adhesive free substrate, high ductility electrolytic copper, applied to the inner layer of ordinary double-sided boards and soft hard bonding boards, with good expansion and contraction stability |
| AK121812EM | 12(1/3) | 18 | 12(1/3) | 500mm*100m | |
| AK122512EM | 12(1/3) | 25 | 12(1/3) | ||
| AK125012EM | 18(1/2) | 50 | 18(1/2) | ||
| AK182518EM | 18(1/2) | 25 | 18(1/2) | ||
| AK185018EM | 18(1/2) | 50 | 18(1/2) | ||
| AK series double-sided adhesive free substrate (HA copper) | Cu um(OZ/ft2) | PI thickness (um) | Cu um(OZ/ft2) | Packaging specifications | application area |
| AK122512RY | 12(1/3) | 25 | 12(1/3) | 250mm*100m | Consumer electronics double-sided adhesive free substrate, HA high ductility rolled copper, applied to the inner layer of ordinary double-sided boards and soft hard bonding boards, with good bending performance |
| AK182518RY | 18(1/2) | 25 | 18(1/2) | 500mm*100m | |
| AK185018RY | 18(1/3) | 50 | 18(1/2) | ||
| KP series double-sided adhesive free substrate | Cu um(OZ/ft2) | PI thickness (um) | Cu um(OZ/ft2) | Packaging specifications | application area |
| KP122512E | 12(1/3) | 25 | 12(1/3) | 250mm*100m | LCD, LCM, TP, camera modules, and consumer electronics application substrates have good expansion and contraction stability, with TD direction heat treatment within 3% and MD convenience within 5%. |
| 500mm*100m | |||||
| KP182518E | 18(1/2) | 25 | 18(1/2) | 250mm*100m | |
| 500mm*100m | |||||
| AP series double-sided adhesive free substrate | Cu um(OZ/ft2) | PI thickness (um) | Cu um(OZ/ft2) | Packaging specifications | application area |
| AP8515R | 18(1/2) | 25 | 18(1/2) | 24in(610mm)* | Industrial double-sided adhesive free substrate, with a normal working temperature of up to 180 ° C and a transmission speed of about 10GHZ, mainly used in industrial, optoelectronic module, automotive, medical, aerospace industries |
| 36in(914mm) | |||||
| AP8525R | 18(1/2) | 51 | 18(1/2) | 24in(610 mm)* | |
| 18in(457mm) | |||||
| AP9111R | 1(35) | 25 | 1(35) | 24in(610mm)* | |
| 12in(305mm) | |||||
| AP9121R | 1(35) | 51 | 1(35) | 12in(610mm)* | |
| AP9131R | 1(35) | 76 | 1(35) | 18in(457mm) | |
| Pyralux ® JT Coverfilm and Bonding Material | |||||
| Product Code | PI thickness (um) | Material characteristics and application fields | Packaging specifications | ||
| JT25 | 25 | Polyamidemide material, with a normal operating temperature of up to 150 ° C | 24in(W)*250ft | ||
| JT50 | 50 | ||||
| Pyralux ® HT Coverfilm and Bonding Material | |||||
| Product Code | PI thickness (um) | Material characteristics and application fields | Packaging specifications | ||
| HT0100 | 25 | Normal working temperature can withstand 225 ° C; High temperature press is required for compression, with a temperature of over 300 ° C | 24in(W)*250ft | ||
| HT7049 | 38 | ||||
| HT0200 | 50 | ||||
| HT0300 | 75 | ||||
| HT series industrial high-temperature resistant substrates | |||||
| HT series double-sided adhesive free substrate | Cu um(OZ/ft2) | PI thickness (um) | Cu um(OZ/ft2) | Packaging specifications | application area |
| HT8515R | 18(1/2) | 25 | 18(1/2) | 24in(610mm)* | Full polyimide double-sided adhesive free substrate, the highest temperature resistant soft board material today, with a working temperature of over 225 ° C, high bonding strength, excellent insulation layer thickness uniformity, and electrical performance |
| 36in(914mm) | |||||
| HT8525R | 18(1/2) | 51 | 18(1/2) | 24in(610mm)* | |
| 18in(457mm) | |||||
| HT9111R | 1(35) | 25 | 1(35) | 24in(610mm)* | |
| 12in(305mm) | |||||
| HT9121R | 1(35) | 51 | 1(35) | 12in(610mm)* | |
| 18in(457mm) | |||||
【Reading Tips and Disclaimer
【 Reading Tips 】
The above is the accumulation of some experience in our company. Due to the wide range of process issues, it is not comprehensive and only analyzes common problems. With the development of the electronics industryNew updates and technological issues continue to emerge. Since its establishment, our company has been constantly pursuing product innovation, keeping pace with the times, familiar with various complex production processes, and able to provide comprehensive assistance to various customers.
Disclaimers
1. The above article content is for readers' reference only. For specific operations, please feel free to contact our technical engineers at any time;
2. The articles published or reprinted on the website are only for the purpose of increasing knowledge and understanding, and do not have any investment opinions or suggestions. If there is any infringement, please contact us for deletion.
3. Except for articles that are "reproduced", the copyright of the original content published on this website belongs to the World Expo website. Without the consent or authorization of this website, no one may reproduce, reproduce, distribute, quote, alter, broadcast or publish all or part of the content in any form, nor may they violate the copyright of this website in any other way
Tel
Customer
TOP
