Time:2022-10-13
Introduction to Flexible Circuit Board Substrate - DuPont
Adhesive substrate
Pyralux ® FR™ andPyralux ® LF™ The copper foil substrate isDuPont Kapton ® PIUse a layer of specialized flame-retardant acrylic adhesive to bond copper foil on one or both sides of the film.
Product features:
Copper foil substrates with various thicknesses of PI or adhesive can be supplied.
Excellent heat resistance, moisture resistance, peel strength, and reliability.
Excellent electrical characteristics, outstanding flexibility and dimensional stability.
Adhesiveless FCCL
Pyralux ®KPDouble sided adhesive free copper-clad laminate made by laminating thermoplastic polyimide film and double-sided copper foil, rolled material, 100rice/volume,provide250mmWith500mmWidth, main recommended modelsKP122512EandKP182518EThe material highlights good dimensional stability and is mainly used forLCMModule and camera module fields.
Pyralux ® AKIt is pressed with copper foilPIA double-sided adhesive free substrate made of thin film, suitable for the production of soft boards with high expansion and high ductility requirements.
For example, the software board used in Apple's high data transmission technology,Pyralux ® AKThe most suitable for the high-quality requirements of soft boards for light, thin, and high-density wiring.
Pyralux ® ACIt is pressed with copper foilPIA single-sided adhesive free substrate made of thin film, suitable forFPCMulti layer board and soft hard combination board outer layer, complete product structure, suitable for various thicknesses of soft and hard boardsStack_upRequirement.
Product features:
Excellent dimensional stability.
Not easy to absorb moisture.
Copper-PIHigh adhesion strength.
Excellent heat resistance.
● Long anti-aging time under high temperature.
● Heat resistant/Moisture resistance characteristics.
● Low thermal expansion coefficient.
High frequency and high speedTASeries double-sided adhesive free substrate
High frequency and low loss dedicated consumer electronics double-sided adhesive free substrate,DK3.2,DF 0.003The transmission frequency can reach10GHZfollowing,2.5db/ 10cm@10GHZ ,2milMicrostrip line design, excellent static bending performance,2milLine width and bending angle360°C, dead bending radius0mm, can>10Secondly, the change in resistivity is less than10%. Applied inUSB 3.0High frequency and low loss fields such as wireless charging coils.
PICover film
Pyralux ® FR™ andPyralux ® LF™ The covering film isDuPont Kapton ® PIOne side of the film is bonded with a layer of specialized flame-retardant acrylic adhesive.Pyralux ® FR™ In the production of circuit boards, it can serve as a protective layer for both soft and rigid boards, with environmentally friendly and solder mask insulation properties.
Product features:
Excellent electrical characteristics.
When pressed, there is less overflow.
Good processability.
● Excellent softness.
DuPont adhesive sheet (pure adhesive)
Pyralux ® FR™ andPyralux ® LF™ Adhesive sheet is a specialized flame-retardant acrylic adhesive. Adhesives are mainly used to bond flexible inner layers and rigid cover layers. Flexible circuit boards can also be bonded to rigid boards during the production process of steel plate circuits, as well as used for interlayer bonding of multi-layer circuit boards.
Product features:
Suitable for multiple presses without deteriorating characteristics.
Long term excellent heat resistance, moisture resistance, and reliability.
Excellent electrical characteristics and flexibility.
【Reading Tips and Disclaimer
【 Reading Tips 】
The above is the accumulation of some experience in our company. Due to the wide range of process issues, it is not comprehensive and only analyzes common problems. With the development of the electronics industryNew updates and technological issues continue to emerge. Since its establishment, our company has been constantly pursuing product innovation, keeping pace with the times, familiar with various complex production processes, and able to provide comprehensive assistance to various customers.
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