Time:2021-03-17
Serial number | project | Process capability | R&D capability |
1 | Number of layers | 1-16 | 18-22 |
2 | Maximum size of production board (mm) | 490*1800,240*4000 | 490*4000 |
3 | Copper thickness of substrate (oz) | 1/3oz-2oz,6oz | 1/4oz-10oz |
4 | Production board thickness (mm) | 0.04-2.5 | 0.03-4 |
5 | Drilling aperture (minimum/aperture tolerance) (mm) | 0.05/±0.02 | 0.025/±0.01 |
6 | Aspect ratio of electroplating holes | 8:1 | 10:1 |
7 | Minimum line width/line spacing (mm) | 0.035/0.035 | 0.02/0.02 |
8 | Minimum Green Oil Bridge (mm) | 0.075 | 0.05 |
9 | surface treatment | Sinking nickel gold, Sinking nickel palladium gold, Thick gold plating, OSP, Sinking tin | / |
10 | Minimum Test Pitch (mm) | 0.1 | 0.075 |
11 | Minimum tolerance of external dimensions (mm) | ±0.03 | ±0.025 |
12 | Solder mask layer | Yellow film, white film, black film, green oil, butter, red oil, black oil | / |
project | Process capability | Production method | |
Processing size (minimum/maximum) (mm) | 50*50/500*500 | ||
Production board thickness (mm) | 0.2-4 | ||
SPI | Volume repeatability accuracy | <1% at 3ơ | Online style |
Stickers | Component size | 0201(Option)75mm connector | |
Pitch(mm) | 0.15 | ||
Repetitive accuracy (mm) | ±0.01 | ||
AOI | FOV size (mm) | 610*450 | Online style |
Test speed (mm ²/Sec) | 9150 | ||
3D X-ray |
Shooting angles (degrees) | 0-45 | Online style |
Position repeatability accuracy (mm) | ±0.5 | Online style |
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