Production process upgrade

Time:2021-03-17



Serial number project Process capability R&D capability
1 Number of layers 1-16 18-22
2 Maximum size of production board (mm) 490*1800,240*4000 490*4000
3 Copper thickness of substrate (oz) 1/3oz-2oz,6oz 1/4oz-10oz
4 Production board thickness (mm) 0.04-2.5 0.03-4
5 Drilling aperture (minimum/aperture tolerance) (mm) 0.05/±0.02 0.025/±0.01
6 Aspect ratio of electroplating holes 8:1 10:1
7 Minimum line width/line spacing (mm) 0.035/0.035 0.02/0.02
8 Minimum Green Oil Bridge (mm) 0.075 0.05
9 surface treatment Sinking nickel gold, Sinking nickel palladium gold, Thick gold plating, OSP, Sinking tin /
10 Minimum Test Pitch (mm) 0.1 0.075
11 Minimum tolerance of external dimensions (mm) ±0.03 ±0.025
12 Solder mask layer Yellow film, white film, black film, green oil, butter, red oil, black oil /
project Process capability Production method
Processing size (minimum/maximum) (mm) 50*50/500*500
Production board thickness (mm) 0.2-4
SPI Volume repeatability accuracy <1% at 3ơ Online style
Stickers Component size 0201(Option)75mm connector
Pitch(mm) 0.15
Repetitive accuracy (mm) ±0.01
AOI FOV size (mm) 610*450 Online style
Test speed (mm ²/Sec) 9150
3D
X-ray
Shooting angles (degrees) 0-45 Online style
Position repeatability accuracy (mm) ±0.5 Online style