With the gradual development of consumer electronic products towards lighter, thinner, and more intelligent applications, higher requirements have been put forward for display technology and data transmission processing capabilities. The diversification of applications and the thinning of volume have also led to the layout of more wires on printed flexible circuit boards in limited areas, continuously developing towards ultra-fine directions such as fine line width, dense wiring, and precise craftsmanship. High density, thinness, flexibility, combination of rigidity and flexibility, and environmentally friendly production have gradually become the direction of future development.
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