The pure adhesive film is made of high adhesive polymer adhesive with a thickness of 12.5-50um. The adhesive film is three layers of composite structure materials, which are protected by a protective film and a release paper. The product is served as a complementary product for flexible copperclad laminate , its functions include surface and heat insulation.
·产品结构及系列Product Structure and Series
|
产品结构 Product structure |
产品系列 Product serides |
|
保护膜 Protect Film
纯胶 Adhesive
离型纸 Release Paper
|
丙烯酸胶系列 Acrylic ester series |
·产品规格 Product Specifications
|
Item（项目） |
Test method（测试方法） |
Specification（规格） |
|
Width（幅宽） |
Specification |
250±1mm |
|
Adhesive thickness（胶层厚度） |
Specification |
12.5-50um |
|
Shelf life（保质期） |
＜25±5℃，＜70%RH |
9months |
·产品性能 Product Properties
|
Item（项目） |
Test method（测试方法） |
Specification（规格） |
|
Peel strength(剥离强度) |
IPC TM650 2.4.9 |
≧1kgf/cm |
|
Volatile Content(挥发物含量) |
IPC TM650 2.3.37 |
≤2% |
|
Solder Float Resistance（耐焊性） |
IPC TM650 2.4.13 |
288℃ 10sec |
|
Chemical Resistance (耐化学性) |
IPC TM650 2.3.2 |
≤20% |
|
Dielectric Constant （介电常数） |
IPC TM650 2.5.5.3 |
≤4.0 |
|
Moisture Absorption（吸湿性） |
IPC TM650 2.6.2 |
≤6.0 |
·产品应用 Product Application
该产品主要应用在FPC的热压合、补强PI、多层板贴合、FR4基板、软硬结合板及铝基金属板的粘接。
The product is mainly used in the FPC hot pressing, strengthening, PI, multilayer board bonding, FR4 substrate, soft and hard bonding plate and aluminum based metal plate bonding.
